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Services

Schleifen, Polieren, Grinding, Polishing, Reclaim

Grinding
Wafer thinning/Backgrindung
More information

Spezielle Schleifarbeiten Special Grinding Services

Polishing
CMP stock polish and final polish
More information

Schleifen, Polieren, Grinding, Polishing, Reclaim

Reclaim
Only Silicon Wafers

Spezielle Schleifarbeiten Special Grinding Services

Special Grinding Services
such as grinding adapter pockets with smaller diameters (pocket Wafers)

Trennschleifen, Formatieren, Dicing

Dicing
Formating Wafers into small Chips
Materials: Silicon-, Glass, Quartz, Sapphire, ...

Laserbearbeitung Laser Processing

Laser Processing
scribing, marking, cutting

Beschichtungen Coatings

Coatings
Metalizatios
PVD / CVD / Electroplating / Evaporating
Dry or Wet Thermal Oxide
Low Temperatore Oxide (LTO)
TEOS SiO2
LPCVD Nitride / PECVD Nitride
Polysilicon
Photoresist
ITO (Indium tin oxide)

Entfernen von Rückseitenoxid Removing SiO2 from wafer back side

Removing SiO2 from wafer back side
by protecting the front side and HF-Dip

Wafer separieren Wafer seperating

Wafer separating
for as few as only one wafer from our stock

Beschichtungen Coatings

Metrology
SEM
AFM
Type- & Resistivity- check
Ellipsometry
Wafer geometry (E&H MX-204)
Layer Thickness (Filmetrics F50-NIR)