Services

 Grinding and Polishing, Reclaim
 Silicon & Glass Wafers

 Dicing
 In various formats

 Oxidation
 Thermal Oxide, dry or wet
 Low Temperature Oxide (LTO) 

 Thin-Film Technology
 PVD, LPCVD, PECVD

 Silicon Property Profiling
 Type-/Resistivity- check, GDMS, SRP, AFM 

 Layer Thickness Measurement
 By Ellipsometer or Filmetrics

 

 more Services on request